Composition and method for polysilicon CMP

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12157834
APP PUB NO 20210062043A1
SERIAL NO

17009961

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A chemical mechanical polishing composition for polishing a substrate having a polysilicon layer includes a water based liquid carrier, a silica abrasive, an amino acid or guanidine derivative containing polysilicon polishing accelerator, and an alkali metal salt. The composition includes less than about 500 ppm tetraalkylammonium salt and has a pH in a range from about 10 to about 11.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
CMC MATERIALS LLC1209 ORANGE STREET WILMINGTON DE 19801

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brosnan, Sarah St. Charles, US 12 17
Reiss, Brian Woodridge, US 32 140

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Jun 3, 2028
7.5 Year Payment $3600.00 $1800.00 $900.00 Jun 3, 2032
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jun 3, 2036
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00