Method and wet chemical compositions for diffusion barrier formation

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12157944
APP PUB NO 20230407467A1
SERIAL NO

18242599

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Abstract

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A method of forming a diffusion barrier layer on a dielectric or semiconductor substrate by a wet process. The method includes the steps of treating the dielectric or semiconductor substrate with an aqueous pretreatment solution comprising one or more adsorption promoting ingredients capable of preparing the substrate for deposition of the diffusion barrier layer thereon; and contacting the treated dielectric or semiconductor substrate with a deposition solution comprising manganese compounds and an inorganic pH buffer (optionally, with one or more doping metals) to the diffusion barrier layer thereon, wherein the diffusion barrier layer comprises manganese oxide. Also included is a two-part kit for treating a dielectric or semiconductor substrate to form a diffusion barrier layer thereon.

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Patent Owner(s)

Patent OwnerAddress
MACDERMID ENTHONE INC245 FREIGHT STREET WATERBURY CT 06702 06702

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hurtubise, Richard W Clinton, US 4 105
Najjar, Elie H Norwood, US 13 71
Shao, Wenbo New Canaan, US 6 12
Sun, Shaopeng Lake Oswego, US 9 7
Wilkins, Taylor L Hamden, US 2 0
Yakobson, Eric East Haven, US 26 208

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