Photosensitive resin composition, method for forming resist pattern, method for manufacturing plated molded article, and semiconductor apparatus

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United States of America

PATENT NO 12158700
APP PUB NO 20210325783A1
SERIAL NO

17269021

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Abstract

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The present photosensitive resin composition includes a polymer (A) having a structural unit (a1) represented by a formula (a1), a structural unit (a2) represented by a formula (a2), and a structural unit (a3) represented by a formula (a3), and a photoacid generator (B). In the formulae (a1) to (a3), R12, R22, and R32 each independently represent an organic group having 1 to 10 carbon atoms; R21 represents a substituted or non-substituted alkyl group having 1 to 10 carbon atoms; R31 represents a hydrogen atom, a substituted or non-substituted alkyl group having 1 to 10 carbon atoms, or a halogen atom; R13 and R23 each independently represent an acid dissociable group; R33 represents a hydroxyaryl group; and l, m and n independently represent an integer from 0 to 10.

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Patent Owner(s)

Patent OwnerAddress
JSR CORPORATION9-2 HIGASHI-SHINBASHI 1-CHOME MINATO-KU TOKYO 105-8640

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsumoto, Tomoyuki Tokyo, JP 17 35
Nishiguchi, Naoki Tokyo, JP 89 808
Sakakibara, Hirokazu Tokyo, JP 40 195
Taniguchi, Takuhiro Tokyo, JP 15 6

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