Wiring board and method for manufacturing wiring board

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12160949
APP PUB NO 20220394842A1
SERIAL NO

17824868

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Importance

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Abstract

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A wiring board, comprising: wiring patterns that are buried in the wiring board, in which a region positioned between wiring patterns disposed in an in-plane direction of the same plane has an elastic modulus at 140° C. equal to or less than 0.1 MPa, and a dielectric loss tangent is equal to or less than 0.006.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM CORPORATION26-30 NISHIAZABU 2-CHOME MINATO-KU TOKYO 1068620 JAPAN

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sasada, Yasuyuki Shizuoka, JP 108 492
Tanaka, Genya Shizuoka, JP 4 0

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