Wiring board having a wiring pattern that has a multi-layer structure
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United States of America
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-
Dec 3, 2024
Grant Date -
N/A
app pub date -
Jul 14, 2022
filing date -
Jul 14, 2022
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A wiring board includes a wiring layer, an insulating layer, a plurality of opening portions, and a connection terminal. The insulating layer is laminated on the wiring layer and covers a wiring pattern. Each of the plurality of opening portions penetrates through the insulating layer to the wiring pattern. The connection terminal is formed on the respective opening portions and comes into contact with the upper surface of the wiring pattern. The wiring layer includes a first wiring pattern, and a second wiring pattern that is formed of a plurality of laminated metal layers and that is thicker than the first wiring pattern. An upper surface of a metal layer serving as an uppermost layer of the second wiring pattern is a contact surface with the connection terminal and has a same width as an upper surface of a metal layer serving as a layer other than the uppermost layer.
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