Removing filling material from a cavity in a component and apparatus for performing same
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
Dec 10, 2024
Grant Date -
Jun 27, 2019
app pub date -
Aug 30, 2017
filing date -
Aug 30, 2017
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Various embodiments may include a method for removing filling material from a cavity in a manufactured component with a connection from the cavity opening to surroundings of the component, the method comprising: holding the component in a movable mounting; moving the component and at the same time removing the filling material through the connection opening; and executing a computer program with a processor, wherein the computer program instructs the processor to: analyze geometry data of the component including the connection opening; and calculate a necessary positioning of the component, based on the geometry data and gravitational force; and direct the movable mounting through a sequence of movements for moving the component in space to spill the filling material from the cavity through the connection opening out of the component.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully