Methods and systems of forming metal interconnect layers using engineered templates

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12165881
APP PUB NO 20230369065A1
SERIAL NO

18358511

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Abstract

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Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This “off-device” approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template may be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.

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Patent Owner(s)

Patent OwnerAddress
MAVLIEV RASHIDCAMPBELL CA 95008

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mavliev, Rashid Campbell, US 41 583

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