Method for manufacturing a ceramic copper circuit board

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12167534
APP PUB NO 20220104351A1
SERIAL NO

17546669

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Importance

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Abstract

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A ceramic copper circuit board according to an embodiment includes a ceramic substrate and a first copper part. The first copper part is bonded at a first surface of the ceramic substrate via a first brazing material part. The thickness of the first copper part is 0.6 mm or more. The side surface of the first copper part includes a first sloped portion. The width of the first sloped portion is not more than 0.5 times the thickness of the first copper part. The first brazing material part includes a first jutting portion jutting from the end portion of the first sloped portion. The length of the first jutting portion is not less than 0 μm and not more than 200 μm. The contact angle between the first jutting portion and the first sloped portion is 65° or less.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOSHIBA1-1 SHIBAURA 1-CHOME MINATO-KU TOKYO 1050023 JAPAN
TOSHIBA MATERIALS CO LTD8 SHINSUGITA-CHO ISOGO-KU YOKOHAMA-SHI KANAGAWA

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kato, Hiromasa Chiba, JP 57 225
Sano, Takashi Kanagawa, JP 128 1002

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