Wiring circuit board, producing method thereof, and wiring circuit board assembly sheet
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
Dec 10, 2024
Grant Date -
Dec 1, 2022
app pub date -
Aug 9, 2022
filing date -
Aug 9, 2022
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.
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