Electrically conductive adhesive, electronic circuit using the same, and method for manufacturing such electronic circuit

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12171062
APP PUB NO 20230319988A1
SERIAL NO

18024527

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Objects of the present invention are to provide an electrically conductive adhesive which is capable of suppressing a rise in an electric resistance value of a joining part between an electronic component and a substrate under high temperature and high humidity while a specific resistance value is suppressed to be low; an electronic circuit using such electrically conductive adhesive; and a method for manufacturing such electronic circuit. According to the present invention, provided is the electrically conductive adhesive which includes an electrically conductive filler, a surface of the electrically conductive filler being a coating layer including silver, a compounded amount of the electrically conductive filler being 29.0 vol. % to 63.0 vol. % with respect to the electrically conductive adhesive, a compounded amount of the silver being 3.5 vol. % to 7.0 vol. % with respect to the electrically conductive adhesive. In addition, also provided are an electronic circuit using the electrically conductive adhesive of the present invention and a method for manufacturing such electronic circuit.

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Patent Owner(s)

Patent OwnerAddress
TOYO ALUMINUM KABUSHIKI KAISHA6-8 KYUTARO-MACHI 3-CHOME CHUO-KU OSAKA-SHI OSAKA 541-0056

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Minamiyama, Hideaki Osaka, JP 7 31
Nakatani, Toshio Osaka, JP 8 82

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