Method of manufacturing printed wiring board

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12171067
APP PUB NO 20220183158A1
SERIAL NO

17442355

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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There is provided a method for manufacturing a printed wiring board that effectively suppresses pattern failure and is also excellent in fine circuit forming properties. This method includes: providing an insulating substrate including a roughened surface; performing electroless plating on the roughened surface of the insulating substrate to form an electroless plating layer less than 1.0 μm thick having a surface having an arithmetic mean waviness Wa of 0.10 μm or more and 0.25 μm or less and a valley portion void volume Vvv of 0.010 μm3/μm2 or more and 0.028 μm3/μm2 or less; laminating a photoresist on the surface of the electroless plating layer; performing exposure and development to form a resist pattern; applying electroplating to the electroless plating layer; stripping the resist pattern; and etching away an unnecessary portion of the electroless plating layer to form a wiring pattern.

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Patent Owner(s)

Patent OwnerAddress
MITSUI MINING & SMELTING CO LTDSHINAGAWA-KU TOKYO 141-8584

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hosokawa, Makoto Ageo, JP 21 193
Iida, Hiroto Ageo, JP 7 7
Mizoguchi, Misato Ageo, JP 4 0
Shimizu, Yoshinori Ageo, JP 89 4122
Takanashi, Akitoshi Ageo, JP 3 1

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