Method of manufacturing an electronic device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12173207
APP PUB NO 20200248040A1
SERIAL NO

16855605

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Abstract

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A method of manufacturing an electronic device comprising the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer; mounting an electrical component on the applied conductive paste; heating the conductive paste to bond the electrically conductive layer and the electrical component, wherein the conductive paste comprises 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.

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Patent Owner(s)

Patent OwnerAddress
CELANESE MERCURY HOLDINGS INCBUILDING 304 EXPERIMENTAL STATION 200 POWDER MILL ROAD WILMINGTON DE 19803

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsuura, Yumi Kanagawa, JP 10 38

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