Package designs to enable dual-sided cooling on a laser chip

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12176676
APP PUB NO 20220123521A1
SERIAL NO

17076443

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Abstract

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Embodiments disclosed herein include dual sided cooling architectures for laser packages. In an embodiment, an electronic package comprises a package substrate, and a laser chip attached to the package substrate. In an embodiment, the laser chip has a first surface and a second surface opposite from the first surface. In an embodiment, an interposer is disposed over the laser chip, where the interposer overhangs an edge of the laser chip. In an embodiment, the electronic package further comprises an interconnect between the interposer and the package substrate.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiu, Chia-Pin Tempe, US 158 2598

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