Method of forming a flexible electronics assembly

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12177968
APP PUB NO 20210315099A1
SERIAL NO

16839565

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Abstract

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A flexible electronics assembly including a substrate including one or more dielectrics. A cavity is formed within the substrate. A first ground plane is secured to the substrate. One or more stress channels are formed through one or more portions of the substrate and the first ground plane. An electronics component is disposed within the cavity.

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Patent Owner(s)

Patent OwnerAddress
THE BOEING COMPANY100 NORTH RIVERSIDE PLAZA CHICAGO IL 60606-2016

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Rogers, John E Owens Cross Roads, US 88 799
Williams, John D Decatur, US 84 1150

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