One component (1K) curable adhesive composition

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12180398
APP PUB NO 20220411673A1
SERIAL NO

17838835

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Abstract

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The present invention is directed to a curable and one component (1K) debondable adhesive composition comprising: a) epoxy resin; b) a curing agent for said epoxy resin; c) an electrolyte; and, d) an electrically non-conductive filler; wherein said composition comprises at least one of: e) a combination of a solubilizer and a toughener; and, f) electrically conductive particles.

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Patent Owner(s)

Patent OwnerAddress
HENKEL AG & CO KGAA40589 DÜSSELDORF

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gutierrez, Diaz Jordan Duesseldorf, DE 3 2
Lieske, Alexandra Duesseldorf, DE 2 0
Moeller, Thomas Duesseldorf, DE 88 843
Stapf, Stefanie Essen, DE 8 3

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