Thermally conductive component with a bulk molded compound and no base coat

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12180411
APP PUB NO 20240360351A1
SERIAL NO

18307876

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Importance

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Abstract

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A body composition comprising: a bulk molded compound (BMC) comprising: one or more thermoset resins; one or more fillers; one or more reinforcements; and one or more binders; a thermally conductive material disposed within the bulk molded compound so that then the body composition as molded into a body the body assists is removing thermal energy.

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Patent Owner(s)

Patent OwnerAddress
VALEO VISIONBOBIGNY

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Adaska, Scott Troy, US 2 0
Darlage, Colby Troy, US 11 7
Fraizer, Robert Auburn Hills, US 8 3

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