Wiring formation method and transfer mold manufacturing method

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12181796
APP PUB NO 20240032205A1
SERIAL NO

18041900

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Provided is an unprecedented and innovative wiring formation method with which it is possible to form transfer wiring using a transfer mold on a substrate having recesses and protrusions on the surface, without carrying out a smoothing process. The wiring formation method includes filling recesses (4a) arranged in a prescribed pattern in a transfer mold (4) having the recesses (4a) with an electroconductive member (2), laying the transfer mold (4) filled with the electroconductive member (2) over the surface of a substrate (1) having recesses and protrusions, transferring the electroconductive member (2) to the surface of the substrate (1), and forming a wiring part (3) on the surface of the substrate (1) using the electroconductive member (2), wherein a soft mold having a durometer A hardness of 40-70 is used as the transfer mold (4).

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Patent Owner(s)

Patent OwnerAddress
CONNECTEC JAPAN CORPORATION3-1 KOUDAN-CHO MYOUKOU CITY NIIGATA 9440020

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Komatsu, Hiroshi Myoko, JP 153 2178
Sakai, Daisuke Myoko, JP 56 219

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