Methods for adjusting surface topography of a substrate support apparatus

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United States of America

PATENT NO 12183621
APP PUB NO 20230005785A1
SERIAL NO

17931444

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Abstract

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Systems, method and related apparatuses for adjusting support elements of a support apparatus to approximate a surface profile of a wafer. The support apparatus may include a group of mutually lateral adjacent support elements, each mutually lateral adjacent support element is configured to independently move at least vertically and comprising an upper surface. The support apparatus may further include a thermal energy transfer device operably coupled to each of the mutually lateral support elements, and an actuator system operably coupled to each of the support elements to selectively move one or more of the mutually lateral support elements vertically.

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Patent Owner(s)

Patent OwnerAddress
MICRON TECHNOLOGY INCBOISE ID 83716

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Shirley, Paul D Boise, US 31 162

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