Embedded printed circuit board

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12185470
APP PUB NO 20230276575A1
SERIAL NO

18169432

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Importance

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Abstract

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An embedded PCB includes a first substrate, an electronic component mounted on the first substrate, a second substrate provided on a side opposite to the first substrate with the electronic component interposed therebetween, and electrically connected to the first substrate via substrate bonding members, and an encapsulating resin filled between the first and second substrates, covering the electronic component, and also filled between the electronic component and the first substrate. The first substrate includes, on a side closer to the electronic component, pads to be bonded to electrodes of the electronic component via bonding portions, and a protective insulating layer including openings. The pads include outermost peripheral pads in an outermost periphery including four corners of an approximately rectangular area in a plan view, and inner pads in an area surrounded by the outermost peripheral pads.

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Patent Owner(s)

Patent OwnerAddress
SHINKO ELECTRIC INDUSTRIES CO LTD80 OSHIMADA-MACHI NAGANO-SHI NAGANO 381-2287

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hatori, Yukinori Nagano, JP 11 30
Kurihara, Takashi Nagano, JP 155 2200
Oi, Kiyoshi Nagano, JP 39 554

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