Method for making printed wiring board, printed wiring board, and adhesive film for making printed wiring board

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12185477
APP PUB NO 20220304163A1
SERIAL NO

17684620

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Importance

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Abstract

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By interposing a hard mask between a dielectric and photo-sensitive material it is possible to form fine via in the dielectric by dry etching without damaging the remaining surface of the dielectric.

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Patent Owner(s)

Patent OwnerAddress
AJINOMOTO CO INC15-1 KYOBASHI 1-CHOME CHUO-KU TOKYO 1048315 JAPAN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hichri, Habib Cupertino, US 41 241

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