Printed circuit board having embedded component

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12185478
APP PUB NO 20230189448A1
SERIAL NO

18055759

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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The disclosure pertains to a method for the bonding of a component embedded into a printed circuit board. The methods include provisions of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer. Methods may also include embedding at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer. Methods may also include application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component. Methods may also include clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist.

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Patent Owner(s)

Patent OwnerAddress
AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFTFABRIKSGASSE 13 LEOBEN 8700

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Stahr, Johannes St. Lorenzen, AT 65 341
Weidinger, Gerald Leoben, AT 34 102
Zluc, Andreas Leoben, AT 36 184

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