Chemical solution used for cleaning or etching ruthenium-containing layer and method for fabricating ruthenium wiring

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United States of America

PATENT NO 12187943
APP PUB NO 20220243127A1
SERIAL NO

17574974

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Abstract

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A chemical solution used for cleaning or etching a ruthenium-containing layer, which can obtain the ruthenium-containing layer having a reduced surface roughness while maintaining a good etching rate against the ruthenium, and a method for fabricating ruthenium wiring. The chemical solution includes orthoperiodic acid, a base component, and any one of a nitrogen-containing heterocyclic compound, an organic phosphonic acid, and an organic carboxylic acid.

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Patent Owner(s)

  • TOKYO OHKA KOGYO CO. LTD

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Koga, Shinya Kawasaki, JP 20 292
Takahashi, Kazuhiro Kawasaki, JP 419 3644
Wada, Yukihisa Kawasaki, JP 61 377

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