SiC-filled polymers with high electrical resistivity and high thermal conductivity

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United States of America

PATENT NO 12187954
SERIAL NO

17530451

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Abstract

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A thermal interface material is made by dispersing in a polymer, such as epoxy, silicone, or urethane, silicon carbide particles which have been previously oxidized to form a strongly adherent insulating layer. The attractive combination of high thermal conductivity and high electrical resistivity is achieved by controlling the thickness of the oxide layer and the loading of the ceramic particles in the polymer matrix.

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Patent Owner(s)

  • WASHINGTON MILLS MANAGEMENT, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cutler, Raymond Ashton Bountiful, US 12 173

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