Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus

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United States of America

PATENT NO 12191178
APP PUB NO 20220181180A1
SERIAL NO

17682235

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Abstract

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A semiconductor manufacturing apparatus including: a first device; a first calculation circuit that calculates one or more feature quantities of the first device from detected physical quantities; and a failure prediction circuit that determines a portion of model data with a minimum deviation between the measured feature quantities vector comprising the measured one or more feature quantities and a feature quantities vector comprising one or more feature quantities at each time in the plurality of pieces of model data, and calculates a predicted time until failure from a difference between the failure time point in the determined piece of model data and a point in time in the determined piece of model data at which the deviation between the measured feature quantities vector and the feature quantities vector at each time of the plurality of portions of model data is the minimum; and stops the receiving of a new substrate to prevent an introduction of defects on the new substrate.

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Patent Owner(s)

  • EBARA CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Araki, Yuji Tokyo, JP 44 1514
Fujikata, Jumpei Tokyo, JP 67 666
Koizumi, Ryuya Tokyo, JP 22 82
Sato, Tensei Tokyo, JP 8 14

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