Fabrication of MEMS device with automated dispensing of damping fluid and viscosity control

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12195326
APP PUB NO 20240174510A1
SERIAL NO

18436381

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Abstract

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A microelectromechanical system (MEMS) device comprising a wafer including a MEMS device in a substrate of the wafer is mounted to a fluid dispenser stage. The MEMS device has a damping structure coupled to a suspended element and one or more fluid confinement structures. The suspended element is connected to a fixed part of the substrate by one or more flexures configured to permit movement of the suspended element relative to the fixed part of the substrate. The damping structure extends into a gap between the suspended element and fixed part of the substrate. The fluid confinement structures permit movement of the damping structure within a limited portion of the gap and confine a viscoelastic fluid to the limited portion of the gap. A viscoelastic fluid is deposited onto the wafer in an area of the wafer configured to communicate the viscoelastic fluid into the limited portion of the gap.

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Patent Owner(s)

Patent OwnerAddress
MIRROCLE TECHNOLOGIES INC4905 CENTRAL AVE SUITE 200 RICHMOND CA 94804

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kindt, Johannes Weimar, DE 15 77
Milanovic, Veljko Richmond, US 25 256
Richter, Stefan Jena, DE 91 928

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