Silver powder and method for producing same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12198829
APP PUB NO 20220258230A1
SERIAL NO

17622275

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Abstract

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There are provided a silver powder, which is able to form an electrically conductive film having a low resistance value even if the period of time for firing an electrically conductive paste is shorter than that for firing conventional electrically conductive pastes when the silver powder is used as the material of the electrically conductive paste, and a method for producing the same. A large-diameter silver powder, which has a crystalline size of 50 nm or less and which has a particle diameter (D50) of 1 μm or more and 4 μm or less, the particle diameter (D50) of the large-diameter silver powder being a particle diameter corresponding to 50% of accumulation in a particle size distribution of the large-diameter silver powder, is mixed with a small-diameter silver powder, which has a crystalline size of 50 nm or less and which has a particle diameter (D50) of 0.3 μm or more and less than 1 μm, the particle diameter (D50) of the small-diameter silver powder being a particle diameter corresponding to 50% of accumulation in a particle size distribution of the small-diameter silver powder, to produce a silver powder, which has a crystalline size of 50 nm or less and which has a pressed density of 6.3 g/cm3 or more.

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Patent Owner(s)

Patent OwnerAddress
DOWA ELECTRONICS MATERIALS CO LTD4-14-1 SOTOKANDA CHIYODA-KU TOKYO 1010021 ?1010021

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujii, Masanori Tokyo, JP 41 155

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