Component-containing substrate

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12200871
APP PUB NO 20230300990A1
SERIAL NO

18180383

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A component-containing substrate includes a substrate base. The substrate base includes one or more wiring layers and one or more insulating layers and includes a cavity. The component-containing substrate further includes a pad at the bottom of the cavity and an electronic component bonded to a surface of the pad exposed in the cavity. A trench is formed in the surface of the pad, the trench continuing from the inside to the outside of the perimeter of the electronic component in a plan view.

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Patent Owner(s)

Patent OwnerAddress
SHINKO ELECTRIC INDUSTRIES CO LTD80 OSHIMADA-MACHI NAGANO-SHI NAGANO 381-2287

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Koshi, Takao Nagano, JP 1 0

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