Method of manufacturing a printed circuit board and printed circuit boards formed thereby

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12200873
APP PUB NO 20220256713A1
SERIAL NO

17729254

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of manufacturing a printed circuit board is provided, comprising: 1) imprinting an electrically conductive circuit pattern on a surface of a substrate; 2) applying a surface treatment composition to the surface of the substrate over the electrically conductive circuit pattern; and 3) allowing the surface treatment composition to form a self-assembled coating layer on the surface of the substrate in the form of a conformal coating. The surface treatment composition comprises: (a) a fluorine-containing polymer; (b) a solvent containing at least one C—F bond; and (c) a rheology modifying component. Also provided are electronic components of a circuit assembly and printed circuit boards, comprising a substrate and a self-assembled coating layer applied to at least one surface of the substrate. The coating layer is in the form of a conformal coating and is formed from the surface treatment composition described above.

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Patent Owner(s)

Patent OwnerAddress
ACULON INC10110 SORRENTO VALLEY ROAD SAN DIEGO CA 92121

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gattuso, Mario San Diego, US 4 0
Hanau, Andres San Diego, US 4 0
Hanson, Eric Lee Carlsbad, US 5 2
Potter, Dean San Diego, US 2 0

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