Wafer level package for device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12209012
APP PUB NO 20230050181A1
SERIAL NO

17792777

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Importance

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Abstract

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According to an example aspect of the present invention, there is provided a wafer level package for a device, the package comprising: a first substrate and a second substrate, a sealing structure comprising a seal ring and a bonding layer between the first substrate and the second substrate, and a lateral electrical connection line on a surface of the first substrate, which lateral electrical connection line extends through the seal ring for creating an electrical connection between the device inside the package and an electrical circuit outside the package.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
TEKNOLOGIAN TUTKIMUSKESKUS VTT OY02150 ESPOO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Jae-Wung Espoo, FI 8 8

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Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Jul 28, 2028
7.5 Year Payment $3600.00 $1800.00 $900.00 Jul 28, 2032
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Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00