Method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed wiring board, dielectric sheet, and substrate for high-frequency printed wiring board

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United States of America

PATENT NO 12213249
APP PUB NO 20220272838A1
SERIAL NO

17632016

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Abstract

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A method for manufacturing a dielectric sheet, includes the steps of extrusion molding a mixture including powder polytetrafluoroethylene and spherical silica at a temperature lower than or equal to a melting point of the polytetrafluoroethylene, and calendering a sheet body obtained by the extrusion molding. A mass ratio of the silica with respect to the polytetrafluoroethylene is 1.3 or greater. An average particle diameter of the silica is 0.1 μm or greater but 3.0 μm or less. A reduction ratio of the extrusion molding is 8 or less.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO ELECTRIC INDUSTRIES LTDOSAKA-SHI OSAKA 541-0041
SUMITOMO ELECTRIC PRINTED CIRCUITS INCSHIGA SHIGA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kaimori, Shingo Osaka, JP 28 131
Kashihara, Hideki Shiga, JP 29 107
Kiya, Satoshi Shiga, JP 15 27
Nakabayashi, Makoto Osaka, JP 48 252
Ninomiya, Takashi Osaka, JP 16 14
Okamoto, Kentaro Osaka, JP 48 295
Okuda, Yasuhiro Osaka, JP 47 406
Sugiura, Motohiko Osaka, JP 14 20
Tokuda, Chiaki Osaka, JP 15 11

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