Method of manufacture for embedded IC chip directly connected to PCB

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12213258
APP PUB NO 20200120811A1
SERIAL NO

16654637

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Devices and methods for forming an electrical circuit out of a conductor embedded in two layers of substrate are disclosed. Portions of the two layers of substrate and the conductor are removed, forming a cavity through the two layers and the conductor. A blocker material is deposited along the wall of the cavity. A portion of the blocker material and adjacent layer of the substrate is removed forming another cavity in contact with a part of the conductor. A surface of the second cavity is then electroless plated by a conductive metal to form part of the electrical circuit.

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Patent Owner(s)

Patent OwnerAddress
AVERATEK CORPORATION550 NUTTMAN STREET SANTA CLARA CA 95054

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Basit, Haris San Jose, US 8 251
Iketani, Shinichi Sunnyvale, US 40 89
Vinson, Michael Riley Sunnyvale, US 19 15

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