Substrate processing method and substrate processing device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12215417
APP PUB NO 20220213596A1
SERIAL NO

17701341

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Abstract

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A predetermined process is performed on two target substrates using a substrate processing device that includes two processing parts for performing a substrate process on each of the two target substrates, a gas supply mechanism for separately supplying gases to the two processing parts, and a common exhaust mechanism for collectively exhausting the gases inside the two processing parts. A first mode is executed in which an HF gas and an NH3 gas are supplied to one of the two processing parts, and the HF gas is not supplied to the other of the two processing parts. Subsequently, a second mode is executed in which the HF gas and the NH3 gas are supplied to the two processing parts under the same gas conditions. In the first mode, a pressure difference is prevented from occurring between the two processing parts.

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Patent Owner(s)

  • TOKYO ELECTRON LIMITED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takahashi, Tetsuro Nirasaki, JP 30 444
Toda, Satoshi Nirasaki, JP 18 320

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