Method for preparing copper azide and cuprous azide encapsulated by conductive metal-organic framework

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United States of America

PATENT NO 12221356
APP PUB NO 20220402769A1
SERIAL NO

17638437

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Abstract

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Provided is a method for preparing copper azide and cuprous azide encapsulated by conductive metal-organic framework. The method uses a conductive copper-containing metal-organic framework material as a precursor, and completes the azidation of the precursor by means of a liquid-solid electrochemical azidation reaction. Copper azide and cuprous azide nanocrystals are highly uniformly embedded within a conductive framework, which may effectively avoid the agglomeration of copper azide and cuprous azide, and reduce static charge generated by friction, displacement, and the like. Meanwhile, the conductive framework may promote the effective transfer of charge, avoid the accumulation of static charge, and improve the electrostatic safety. In addition, the liquid-solid electrochemical azidation reaction has advantages such as being safe and efficient, having a short reaction time and having strong operability, and the preparation process is compatible with a MEMS process, which is beneficial for the application of copper azide and cuprous azide materials in micro devices.

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Patent Owner(s)

  • NANJING UNIVERSITY OF SCIENCE AND TECHNOLOGY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Junhong Nanjing, CN 25 117
Chen, Yajie Nanjing, CN 50 220
Hu, Bin Nanjing, CN 275 1156
Qin, Zhichun Nanjing, CN 1 0
Tian, Guirong Nanjing, CN 1 0
Wang, Jiaxin Nanjing, CN 36 119
Ye, Jiahai Nanjing, CN 1 0
Yu, Chunpei Nanjing, CN 1 0
Zhang, Wenchao Nanjing, CN 20 40
Zheng, Zilong Nanjing, CN 3 3

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