Microporous plating solution and method of using this plating solution to perform microporous plating on object to be plated

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United States of America

PATENT NO 12221715
APP PUB NO 20220213606A1
SERIAL NO

17438149

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Abstract

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A microporous plating solution characterized by containing nonconductive particles and polyaluminum chloride allows for easy preparation of positively charged nonconductive particles and is highly stable. Then, a method for performing microporous plating on an object to be plated, characterized by plating the object to be plated in the microporous plating solution results in a favorable number of micropores in the plating.

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Patent Owner(s)

  • JCU CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Shibata, Kana Kanagawa, JP 5 3

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