Metal heterojunction structure with capping metal layer

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United States of America

PATENT NO 12224179
APP PUB NO 20230230846A1
SERIAL NO

18184438

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Abstract

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The current disclosure describes techniques of protecting a metal interconnect structure from being damaged by subsequent chemical mechanical polishing processes used for forming other metal structures over the metal interconnect structure. The metal interconnect structure is receded to form a recess between the metal interconnect structure and the surrounding dielectric layer. A metal cap structure is formed within the recess. An upper portion of the dielectric layer is strained to include a tensile stress which expands the dielectric layer against the metal cap structure to reduce or eliminate a gap in the interface between the metal cap structure and the dielectric layer.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Kei-Wei Hsinchu, TW 247 1209
Chen, Liang-Guang Hsinchu, TW 82 310
Cheng, Yang-Chun Hsinchu, TW 13 12
Ho, Chia-Wei Hsinchu, TW 13 29
Hong, William Weilun Hsinchu, TW 32 54
Hsu, Chun-Wei Hsinchu, TW 114 641
Kung, Te-Ming Hsinchu, TW 15 30
Lin, Yi-Sheng Hsinchu, TW 94 431
Liu, Chi-Jen Hsinchu, TW 60 221
Shen, Chi-Hsiang Hsinchu, TW 21 11

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