Bonding sheet

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United States of America

PATENT NO 12226820
APP PUB NO 20230070283A1
SERIAL NO

17793465

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Abstract

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Provided is a bonding sheet using a copper particle that is less prone to deteriorate the sintering property due to oxidation of the copper particle, and can form a dense bonding layer having fewer voids, and can also bond an electronic component and the like with a high bonding strength. A bonding sheet (1) contains a copper particle (2) and a solvent (3) having a boiling point of 150° C. or higher, in which the copper particle (2) has a surface covered with an organic protective film, the content ratio of the copper particle (2) to the solvent (3) is in the range of 99:1 to 90:10 by mass, and the BET diameter of the copper particle (2) is in the range of 50 nm to 300 nm both inclusive.

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Patent Owner(s)

  • MITSUBISHI MATERIALS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Masuyama, Kotaro Tokyo, JP 8 7
Nakaya, Kiyotaka Tokyo, JP 36 39
Otogawa, Kohei Tokyo, JP 6 0
Yamaguchi, Tomohiko Tokyo, JP 18 155

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