Additive manufacturing process of 3D electronic substrate

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12226822
APP PUB NO 20230381863A1
SERIAL NO

18448311

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A method of forming electronic substrates and assemblies is provided. The method includes forming a first layer, including co-depositing a first material and a second material, where the first material and the second material are co-deposited as powders, binders, slurries, inks, or combinations thereof, and at least partially sintering or curing the first layer of co-deposited materials. Further, the method includes forming a second layer, including co-depositing the first material and the second material, and at least partially sintering or curing the second layer of co-deposited materials. Additionally, the method includes retrieving a solid electronic substrate wherein the sintered or cured first material of the first layer forms the solid electronic substrate and the sintered or cured second material of the first layer forms a feature in or on the solid electronic substrate.

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Patent Owner(s)

  • DOWELL -- A DIVISION OF SCHLUMBERGER TECHNOLOGY CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dunford, Steven O Missouri City, US 19 161
Kostinovsky, Mark Houston, US 5 20

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