Connector production method and adhesive film

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12227683
APP PUB NO 20230002644A1
SERIAL NO

17781729

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A method of producing a connected body, containing: disposing an adhesive film between a first electronic member having a first electronic electrode and a second electronic member having a second electrode; and pressure-bonding the second electronic member to the first electronic member via the adhesive film so that the second electrode is electrically connected to the first electrode; wherein the first electronic member has an indented surface, the first electrode is provided in a depressed portion of the indented surface, the second electrode has a substantially flat surface having an area larger than an area of the first electrode, the adhesive film contains: first conductive particles that are dendritic conductive particles; and second conductive particles containing a non-conductive core and a conductive layer provided on the core, and the second conductive particles have an average particle diameter of not less than a depth of the depressed portion.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Izawa, Hiroyuki Tokyo, JP 34 382
Kikuchi, Kenta Tokyo, JP 30 25
Mori, Takuya Tokyo, JP 103 690
Shirakawa, Tetsuyuki Tokyo, JP 11 12

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