Bond wire payoff system and method

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12230424
SERIAL NO

17730412

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Importance

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Abstract

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System and method for improved bond wire payoff during the armoring process of armored cables and metal-clad cables is disclosed. A bond wire payoff system includes a bare bond wire; a bond wire payoff assembly; a sensor assembly connected to the bond wire payoff assembly, wherein the bare bond wire passes through the sensor assembly; a controller coupled with the sensor assembly, wherein the controller detects a break in the bare bond wire; and an alarm, wherein the alarm is triggered when a break in the bare bond wire is detected.

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Patent Owner(s)

  • ENCORE WIRE CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Smith, Jeremy T The Colony, US 1 0

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