Multilayer electronic component

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12230449
APP PUB NO 20230215654A1
SERIAL NO

17894273

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on a portion of the first surface, and a third band portion on a portion of the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on a portion of the first surface, and a fourth band portion on a portion of the second surface, an insulating layer disposed on the first and second connection portions and covering the second surface and the third and fourth band portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes an oxide containing Ba.

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First Claim

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Patent Owner(s)

  • SAMSUNG-ELECTRO-MECHANICS CO. LTD.

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Han, Seung Hun Suwon-si, KR 48 139
Jo, Ji Hong Suwon-si, KR 158 364
Kim, Sung Soo Suwon-si, KR 138 622
Lim, Jin Hyung Suwon-si, KR 24 99
Na, Jae Young Suwon-si, KR 21 28

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