Photolithography alignment process for bonded wafers

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United States of America

PATENT NO 12230585
APP PUB NO 20240186258A1
SERIAL NO

18420972

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Abstract

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Various embodiments of the present disclosure are directed towards a method for forming an integrated chip. An alignment process is performed on a first semiconductor workpiece and a second semiconductor workpiece by virtue of a plurality of workpiece pins. The first semiconductor workpiece is bonded to the second semiconductor workpiece. A shift value is determined between the first and second semiconductor workpieces by virtue of a first plurality of alignment marks on the first semiconductor workpiece and a second plurality of alignment marks on the second semiconductor workpiece. A layer of an integrated circuit (IC) structure is formed over the second semiconductor workpiece based at least in part on the shift value.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Sz-Fan Kaohsiung, TW 9 7
Chiou, De-Yang Hsinchu, TW 12 8
Hu, Han-Jui Tainan, TW 3 6
Lee, Ru-Liang Hsinchu, TW 81 472
Li, Ching I Tainan, TW 38 25
Lin, Yeong-Jyh Caotun Township, TW 59 216
Wang, Ching-Hung Hsinchu, TW 23 55
Yu, Chung-Yi Hsin-Chu, TW 191 1387

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