High speed data communications system for industrial use in packaged goods with out of band communications hand off
Number of patents in Portfolio can not be more than 2000
United States of America
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Feb 18, 2025
Grant Date -
Apr 20, 2023
app pub date -
Oct 15, 2021
filing date -
Oct 15, 2021
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method for providing an electronic device includes manufacturing the electronic device at a manufacturing location, wherein manufacturing the electronic device includes connecting a wireless receiver system to the electronic device. The method further includes packaging the electronic device at a packaging location. The method further includes wirelessly transmitting data to the electronic device at a data transmission site, wherein wirelessly transmitting the data to the electronic device is performed by transferring data via near field magnetic induction utilizing a wireless transmission system and transmitting data via an out of band communications system, the wireless transmission system configured to magnetically connect with the wireless receiver system associated with the electronic device.
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