Copper paste, wick formation method, and heat pipe

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United States of America

PATENT NO 12233460
APP PUB NO 20230356294A1
SERIAL NO

18026244

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Abstract

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Provided is a copper paste for forming a wick of a heat pipe, the copper paste containing copper particles, thermally decomposable resin particles, a dispersion medium for dispersing the copper particles and the thermally decomposable resin particles, and a thermally decomposable resin that is soluble in the dispersion medium.

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Patent Owner(s)

  • RESONAC CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ejiri, Yoshinori Tokyo, JP 41 146
Ishikawa, Dai Tokyo, JP 70 10378
Nakako, Hideo Tokyo, JP 32 112
Natori, Michiko Tokyo, JP 13 46
Tanaka, Toshiaki Tokyo, JP 351 6602

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