Connection structure, method of manufacturing connection structure, connection material, and coated conductive particle

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12237096
APP PUB NO 20220223315A1
SERIAL NO

17607466

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A connection structure, a method of manufacturing the connection structure, a connection material, and a coated conductive particle capable of reducing and stabilizing a conduction resistance value. The connection structure includes: a first electronic component having a first terminal; a second electronic component having a second terminal, and a cured film provided between the first electronic component and the second electronic component and formed by curing the connection material, wherein, with regard to the coated conductive particles between the first terminal and the second terminal, metal atoms of the conductive layer diffuse into the metal of the metal fine particles, and metal atoms of the first terminal and the metal atoms of the second terminal diffuse into the metal of the metal fine particles.

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Patent Owner(s)

  • DEXERIALS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aoki, Masaharu Tochigi, JP 15 180
Kuga, Shoko Tochigi, JP 4 8
Namiki, Hidetsugu Tochigi, JP 46 439
Sugioka, Saori Tochigi, JP 2 3
Tanaka, Yusuke Tochigi, JP 410 2974

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