Apparatus and method for processing substrate using plasma

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12237151
APP PUB NO 20230197412A1
SERIAL NO

17885543

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate processing apparatus using plasma capable of efficiently controlling the selectivity ratio of a silicon layer and an oxide layer is provided. The substrate processing apparatus comprises a first space disposed between an electrode and an ion blocker; a second space disposed between the ion blocker and a shower head; a processing space under the shower head for processing a substrate; a first supply hole for providing a first gas for generating plasma to the first space; a second supply hole for providing a second gas to be mixed with an effluent of the plasma to the second space; and a first coating layer formed on a first surface of the shower head facing the second space, not formed on a second surface of the shower head facing the processing space, and containing nickel.

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Patent Owner(s)

  • SEMES CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Han, Min Sung Gyeonggi-do, KR 12 55
Kim, Dong Hun Seoul, KR 69 562
Lee, Seong Gil Gyeonggi-do, KR 16 2
Noh, Myoung Sub Gyeonggi-do, KR 10 0
Oh, Dong Sub Busan, KR 18 14
Park, Wan Jae Gyeonggi-do, KR 35 40
Um, Young Je Busan, KR 12 0

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