Wiring circuit board

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12238859
APP PUB NO 20230147342A1
SERIAL NO

18054029

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and covering the conductive pattern, and a third protective layer disposed between the conductive pattern and the second insulating layer and protecting the conductive pattern. The third protective layer consists of a metal oxide.

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Patent Owner(s)

  • NITTO DENKO CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakanishi, Yosuke Osaka, JP 34 58
Niino, Teppei Osaka, JP 17 6
Shibata, Shusaku Osaka, JP 38 78

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