Method for manufacturing component embedded circuit board

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12238871
APP PUB NO 20220030720A1
SERIAL NO

17497809

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A component embedded circuit board includes a printed circuit board, a dielectric layer, and an antenna structure laminated in that order. The printed circuit board includes a first opening and a first circuit layer, and the first circuit layer includes at least one first connecting pad. A second opening is defined in the dielectric layer. A conductive structure is embedded in the dielectric layer. The second opening penetrates the dielectric layer. The antenna structure includes a first ground layer. A component is embedded in the first opening. One end of the conductive structure is connected to the first ground layer, and the other end of the conductive structure is connected to the first connecting pad. The second opening corresponds to the first opening. A gap is generated by the second opening and the component. A method for manufacturing the package circuit structure is also disclosed.

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Patent Owner(s)

  • QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD; AVARY HOLDING (SHENZHEN) CO., LIMITED.

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wei, Yong-Chao Qinhuangdao, CN 22 8
Yang, Yong-Quan Qinhuangdao, CN 9 7

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