Flow metrology calibration for improved processing chamber matching in substrate processing systems

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12241772
APP PUB NO 20240255341A1
SERIAL NO

18631708

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Abstract

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A method for calibrating a gas flow metrology system for a substrate processing system includes a) measuring temperature using a first temperature sensor and a reference temperature sensor over a predetermined temperature range and determining a first transfer function; b) measuring pressure using a first pressure sensor and a reference pressure sensor over a predetermined pressure range using a first calibration gas and determining a second transfer function; c) performing a first plurality of flow rate measurements in a predetermined flow rate range with a first metrology system and a reference metrology system, wherein the first metrology system and the reference metrology system use a first orifice size and the first calibration gas; and d) scaling temperature and pressure using the first transfer function and the second transfer function, respectively, and determining a corresponding transfer function for the first calibration gas based on the first plurality of flow rate measurements.

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Patent Owner(s)

  • LAM RESEARCH CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Agarwal, Piyush Newark, US 57 260
Spyropoulos, Evangelos T San Jose, US 6 8

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