Chemical solution, etching method, and method for manufacturing semiconductor device

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United States of America

PATENT NO 12243751
APP PUB NO 20220310401A1
SERIAL NO

17466273

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Abstract

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According to one embodiment, a chemical solution comprises a mixed acid including an inorganic acid, an oxidizing agent, a carboxylic acid, and water; and polyethyleneimine of a concentration in the chemical solution in a range of 0.05 wt % to 10 wt %.

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Patent Owner(s)

  • KIOXIA CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujita, Hiroshi Mie Mie, JP 287 3126
Kitagawa, Hakuba Yokkaichi Mie, JP 12 9
Koide, Tatsuhiko Kuwana Mie, JP 42 327

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