Connection structure and method of forming the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12243813
APP PUB NO 20240055344A1
SERIAL NO

18483884

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Importance

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Abstract

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Provided is a connection structure for a semiconductor package which includes: a first passivation layer having an opening; a first conductive pattern that penetrates the first passivation layer and protrudes upwardly from the first passivation layer; a second passivation layer on the first passivation layer and covering the first conductive pattern; a second conductive pattern on the second passivation layer and electrically connected to the first conductive pattern; a third passivation layer on the second passivation layer and covering the second conductive pattern; and an external terminal in the opening and electrically connected to the first conductive pattern, wherein the first conductive pattern is thicker than the second conductive pattern.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO. LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Jongyoun Seoul, KR 52 71

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